High-temperature-resistant and high-frequency-resistant fine enameled round copper wire
The invention relates to a high-temperature-resistant and high-frequency-resistant fine enameled round copper wire which comprises an insulating layer and a round copper wire conductor, and the component of the insulating layer is modified polyetherimide; the modified polyetherimide is prepared by u...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a high-temperature-resistant and high-frequency-resistant fine enameled round copper wire which comprises an insulating layer and a round copper wire conductor, and the component of the insulating layer is modified polyetherimide; the modified polyetherimide is prepared by uniformly mixing polyetherimide resin and polymerized and coated cerium silicide microspheres in an organic solvent and then drying; wherein the mass ratio of the polyetherimide resin to the polymerized coated cerium silicide microspheres is (78-85): (15-22). The modified polyetherimide prepared by the invention is prepared by mixing and crosslinking the polyetherimide resin and the polymerized and coated cerium silicide microspheres, and the prepared material as an insulating layer has better high temperature resistance, high frequency resistance and breakdown resistance compared with the independently used polyetherimide resin.
本发明涉及一种耐高温耐高频微细漆包圆铜线,包括绝缘层和圆铜线导体,其中,绝缘层的成分为改性聚醚酰亚胺;改性聚醚酰亚胺是将聚醚酰亚胺树脂和聚合包覆硅化铈微球先在有机溶剂内混合均 |
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