Resin composition and application thereof

The invention provides a resin composition and application thereof, and the resin composition comprises the following components by weight: 10-30% of thermosetting resin; 5-20% of an assistant crosslinker; 5-20% of a hydrogenated styrene elastomer; 40-80% of a filler; the hydrogenated styrene elastomer has a structure of L-M-L. The plate prepared from the resin composition has low thermal expansion coefficients in the X-axis, the Y-axis and the Z-axis, has excellent dielectric properties, and is small in dielectric loss factor change amplitude after high-temperature treatment; the prepreg prepared from the resin composition disclosed by the invention can meet the performance requirements of high-frequency and high-speed copper foil substrates with higher requirements on thermal expansion coefficients. 本发明提供一种树脂组合物及其应用，所述树脂组合物按照重量百分比计，包括以下组分：热固性树脂10-30％；助交联剂5-20％；氢化苯乙烯系弹性体5-20％；填料40-80％；所述氢化苯乙烯系弹性体具有L-M-L的结构。使用本发明的树脂组合物制备得到的板材在X轴、Y轴以及Z轴均具有较低的热膨胀系数，具备优异的介电性能，且经高温处理后介电损耗因子变化幅度小；使用本发明的树脂组合物制备得到的预浸料，可以满足对热膨胀系数有更高要