Cutting control system in wafer packaging based on visual analysis

The invention discloses a cutting control system in wafer packaging based on visual analysis, relates to the technical field of wafer packaging, and aims at the cutting process after wafer-level packaging and based on the basic principle of mechanical visual analysis, the positions of all chips in a whole wafer are analyzed in a unified mode, and the cutting control system is used for controlling the cutting process after wafer-level packaging. The whole cutting process is based on an ideal feeding track, the cutting damage problem of the ideal feeding track to the position of the chip is directly judged according to the parallelism and the contact degree between the position of the chip at each position and the ideal feeding track, and on the basis of the technical principle, the cutting damage problem of the ideal feeding track to the position of the chip is solved. According to the method, the positions of the chips with the cutting damage problem in the whole wafer are isolated and finely adjusted to gene