Electronic device and heat dissipation assembly thereof
The invention discloses an electronic device which comprises a circuit board, a heat dissipation assembly and a base. The circuit board comprises a heating source. The heat dissipation assembly comprises a shell, a heat conduction pipe and a heat dissipation module. The shell comprises an internal c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an electronic device which comprises a circuit board, a heat dissipation assembly and a base. The circuit board comprises a heating source. The heat dissipation assembly comprises a shell, a heat conduction pipe and a heat dissipation module. The shell comprises an internal containing space, and the heat dissipation module is arranged in the internal containing space and makes contact with the heat release section. The heat dissipation module comprises a first fin group and a second fin group which are stacked with each other. The first fin group comprises a plurality of first heat dissipation fins. The first heat dissipation fins are arranged side by side at intervals in a first arrangement direction. The second fin group comprises a plurality of second heat dissipation fins. The second heat dissipation fins are arranged side by side at intervals in the second arrangement direction. The first arrangement direction is different from the second arrangement direction. The base is connect |
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