Oscillator, manufacturing method thereof and electronic equipment

The invention relates to an oscillator, a manufacturing method thereof and electronic equipment. The oscillator comprises a resonator which comprises a vibration element and an airtight packaging structure packaged at the periphery of the vibration element; the oscillation chip is arranged on one side of the airtight packaging structure; the insulating layer covers one side of the oscillation chip and one side of the airtight packaging structure, the insulating layer is provided with a first via hole, and a conductive material is arranged in the first via hole; and the first electrode structure is arranged on the insulating layer and is electrically connected with the oscillation chip through the conductive material in the first via hole. 本申请涉及一种振荡器及其制造方法、电子设备。所述振荡器包括：谐振器，包括振动元件和封装在所述振动元件外围的气密封装结构；振荡芯片，设置在所述气密封装结构的一侧；绝缘层，覆盖在所述振荡芯片和所述气密封装结构的一侧，所述绝缘层具有第一导通孔，所述第一导通孔中具有导电材料；以及第一电极结构，设置在所述绝缘层上，且经由所述第一导通孔中的所述导电材料与所述振荡芯片电连接。