Chip packaging method and packaging structure

The invention relates to a chip packaging method and a chip packaging structure. The chip packaging method comprises the steps that at least one back film body is arranged on the side, away from the rewiring layer, of the packaging layer, all the back film bodies are attached to the packaging layer in a hot pressing mode to form a back film layer, and the expansion coefficient of the back film layer is close to that of the rewiring layer. In the hot pressing process, the chip packaging unit and the back film layer are heated at the same time, and the chip packaging unit and the back film layer are subjected to thermal expansion. The expansion coefficient of the back film layer is close to the expansion coefficient of the rewiring layer, and the packaging layer and the chip body are clamped between the back film layer and the rewiring layer, so that the thermal expansion of the packaging layer and the chip body is limited, the thermal expansion of the chip packaging unit is similar to that of the back film lay