Improved photonic integrated circuit device package

In one embodiment, an integrated circuit device includes a substrate, an electronic integrated circuit (EIC), a photonic integrated circuit (PIC) electrically coupled to the EIC, and a glass block at least partially in a cavity defined by the substrate and at an end of the substrate. The glass block defines an optical path having one or more optical elements to direct light between the PIC and a fiber array unit (FAU) when the PIC and the FAU are attached to the glass block. 在一个实施例中，集成电路器件包括基板、电子集成电路(EIC)、电耦合到EIC的光子集成电路(PIC)、以及至少部分地在由基板限定的空腔中和在基板的端部处的玻璃块。玻璃块限定具有一个或多个光学元件的光学路径，以在PIC和光纤阵列单元(FAU)附接到玻璃块时在PIC和FAU之间引导光。