Ultrasonic-assisted laser material reduction machining table and laser material reduction device
The invention discloses an ultrasonic-assisted laser material reduction machining table and a laser material reduction device, and belongs to the technical field of laser machining. A standing wave field is formed between an ultrasonic emitter and an ultrasonic reflector, and plasma and melt in a pr...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses an ultrasonic-assisted laser material reduction machining table and a laser material reduction device, and belongs to the technical field of laser machining. A standing wave field is formed between an ultrasonic emitter and an ultrasonic reflector, and plasma and melt in a processing area are blown to an area where the standing wave field is located through an air blowing device, so that splashes and plasma condensate generated after condensation are gathered at all wave nodes under the action of ultrasonic waves; under the action of negative pressure suction force, the dust is discharged through the corresponding negative pressure dust suction opening; according to the invention, plasmas and melts can be simply and rapidly blown out of a processing area, and condensates can be rapidly gathered to ultrasonic wave nodes to be removed; therefore, the problems that in the laser machining process, plasmas and melts fall and condense on the machining face after being sprayed out, and plasma |
---|