SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The purpose of the present invention is to provide a technique capable of suppressing the occurrence of a crack at a cut-off site of a molded part when a flow path part connecting adjacent molded parts is cut off and removed. The semiconductor manufacturing apparatus includes: a plurality of cavities (23a, 23b) filled with a molding resin and each molding a plurality of molding portions; and at least one flow path (24a), one end of which is connected to the gate (25a) of one of the adjacent mold cavities (23a, 23b), the other end of which is connected to the gate (25b) of the other mold cavity (23b) of the adjacent mold cavities (23a, 23b), and through which the molding resin flows, the height position of the upper end on the one end side of the at least one flow path (24a) is higher than the height position of the upper end on the other end side of the at least one flow path (24a). 目的在于提供在切断而去除了将相邻的模塑成型部连接的流道部时，能够对在模塑成型部的切断部位产生裂缝进行抑制的技术。半导体制造装置具有：多个模腔(23a、23b)，它们被填充模塑树脂而各自对多个模塑成型部进行成型；以及至少1个流道(24a)，其一端与相邻的模腔