Slice, method for producing slice, and adhesive composition

The invention provides a slice which is excellent in blocking resistance, can be dissolved in an organic solvent in a short time, can obtain an adhesive composition which is excellent in brushability and layer separation resistance and is not colored, a method for producing the slice, and an adhesiv...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAOKA KOUTA, KUMAGAI YUSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides a slice which is excellent in blocking resistance, can be dissolved in an organic solvent in a short time, can obtain an adhesive composition which is excellent in brushability and layer separation resistance and is not colored, a method for producing the slice, and an adhesive composition which is excellent in brushability and layer separation resistance and is less colored. According to the present invention, provided is a slice for an adhesive composition, which contains a chloroprene polymer rubber and is characterized in that the temperature in the vicinity of the center of the slice is 130 DEG C or less after the slice heated to 140 DEG C is held in a room at 23 DEG C for 60 seconds, the slice is press-molded into a sheet having a thickness of 6 mm at 70 DEG C, the sheet is taken out from a mold and left to stand in an environment at 23 DEG C for 1 hour, and then the sheet is pressed and molded into a sheet having a thickness of 6 mm. When the sheet having a thickness of 6 mm is p