Wafer assembly for electrical connector assembly

A wafer assembly (230) includes a lead frame (240) having signal contacts (206) and a cable (202), with signal conductors (500, 502) terminated to the respective signal contacts. Each cable includes a cable shield (506) that provides shielding for the signal conductor. The wafer assembly includes a...

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Bibliographische Detailangaben
Hauptverfasser: MORGAN, CHAD, W, STRECKWALD MICHAEL, LACHMAN JULIA ANNE, PICKEL JUSTIN D
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A wafer assembly (230) includes a lead frame (240) having signal contacts (206) and a cable (202), with signal conductors (500, 502) terminated to the respective signal contacts. Each cable includes a cable shield (506) that provides shielding for the signal conductor. The wafer assembly includes a wafer body (242) holding the signal contacts. The wafer assembly includes first and second ground frames (600, 602) coupled to the first and second sides (213, 214) of the wafer body to provide electrical shielding for the lead frame. The ground frame includes ground shields (620) that provide shielding for mating ends (234) of the respective signal contacts. The ground frame includes cable covers (640) coupled to respective cable shields. 一种晶片组件(230),包括具有信号触头(206)和电缆(202)的引线框架(240),其中信号导体(500,502)端接到相应的信号触头。每个电缆包括为信号导体提供屏蔽的电缆屏蔽(506)。晶片组件包括保持信号触头的晶片体(242)。晶片组件包括第一和第二接地框架(600,602),第一和第二接地框架联接到晶片体的第一和第二侧面(213,214),以便为引线框架提供电屏蔽。接地框架包括为相应信号触头的配合端(234)提供屏蔽的接地屏蔽(620)。接地框架包括联接到相应电缆屏蔽的电缆盖(640)。