Automatic semiconductor testing device
A semiconductor automatic testing device disclosed by the present invention comprises a needle tube, one end of the needle tube is telescopically provided with a first needle head, the other end of the needle tube is telescopically provided with a second needle head, a spring is arranged in the need...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A semiconductor automatic testing device disclosed by the present invention comprises a needle tube, one end of the needle tube is telescopically provided with a first needle head, the other end of the needle tube is telescopically provided with a second needle head, a spring is arranged in the needle tube, and two ends of the spring are respectively in contact with the tails of the first needle head and the second needle head. Balls are arranged on the outer sides of the tails of the first needle head and the second needle head and make contact with the inner wall of the needle tube. According to the semiconductor automatic test device, the problem that the test result is inaccurate due to the fact that the requirement for impedance of the probe is very high in the test process and the friction force of the normal test probe is too large in the test process can affect the test data of the semiconductor is solved.
本发明公开了一种半导体自动测试装置,包括针管,所述针管的一端可伸缩地设置有第一针头,另一端可伸缩地设置有第二针头,针管内设置有弹簧,弹簧的两端分别与第一针头和第二针头的尾部相接触,第一针头和第 |
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