Silver alloy bonding wire and preparation method thereof

The invention discloses a silver alloy bonding wire and a preparation method thereof. The bonding wire comprises 1.1%-2.2% of palladium, 4.2%-9.6% of gold, 300-800 ppm of microelements and the balance silver. The preparation method comprises the following steps: S1, proportioning according to the ra...

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Bibliographische Detailangaben
Hauptverfasser: PENG XIAOFEI, HUO JIANPING, WANG YOUREN, PENG SHUYAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a silver alloy bonding wire and a preparation method thereof. The bonding wire comprises 1.1%-2.2% of palladium, 4.2%-9.6% of gold, 300-800 ppm of microelements and the balance silver. The preparation method comprises the following steps: S1, proportioning according to the ratio; s2, Au, Pd and doping elements are added into the silver raw material according to the predetermined material use proportion, and a wire rod with the diameter being 6-8 mm is obtained through a directional continuous drawing process; s3, the wire is subjected to homogenizing annealing; s4, the wire obtained in the casting step is subjected to wire drawing; s5, annealing the drawn silver alloy bonding wire again; s6, surface cleaning and drying; s7, sampling the silver alloy bonding wire, and then putting the silver alloy bonding wire into a tension test device for tension test; and S8, after the test is qualified, the finished product silver alloy bonding wire is rewound, coiled and packaged. The silver alloy