Punching process for composite strip, light-emitting module and electronic equipment

The invention provides a punching process for a composite strip, a light-emitting module and electronic equipment. The composite strip comprises a circuit board and a gelatinous layer covering the circuit board, and the punching technology comprises the steps that the composite strip is provided, and the composite strip is flatly laid on a cutting table; the composite strip is cut at a preset cutting position from the side, away from the circuit board, of the gelatinous layer, and the cutting depth at least extends into the gelatinous layer with a part of thickness; and stamping a target strip, located in an area surrounded by the preset cutting position, of the composite strip from the side, away from the circuit board, of the gelatinous layer until the target strip falls off from the composite strip. When the punching process is applied to punching of a composite strip comprising a plurality of light-emitting modules, the phenomenon that a gelatinous layer in the manufactured light-emitting module protrudes