Systems and methods for feature signal enhancement using selectively bound photoluminescent materials

In accordance with one or more embodiments of the present disclosure, a patterned wafer is disclosed. The patterned wafer may include at least a first material and at least a second material, wherein the first material may be different than the second material. The patterned wafer may further includ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN GRACE H, JIN JINSANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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