Systems and methods for feature signal enhancement using selectively bound photoluminescent materials

In accordance with one or more embodiments of the present disclosure, a patterned wafer is disclosed. The patterned wafer may include at least a first material and at least a second material, wherein the first material may be different than the second material. The patterned wafer may further include a photoluminescent material configured to be selectively bonded to one of the first material or the second material to enhance a feature of interest. 根据本公开的一或多个实施例，公开一种图案化晶片。所述图案化晶片可包含至少第一材料及至少第二材料，其中所述第一材料可不同于所述第二材料。所述图案化晶片可进一步包含光致发光材料，其经配置以选择性地结合到所述第一材料或所述第二材料中的一者以增强关注特征。