High-resolution negative photoresist as well as preparation method and application thereof

The invention provides a high-resolution negative photoresist as well as a preparation method and application thereof. The high-resolution negative photoresist is prepared from the following raw materials in parts by weight: 25-50 parts of acrylic resin, 5-20 parts of a photoinitiator, 10-25 parts of a cross-linking agent, 30-60 parts of a solvent and a flatting agent, and the concentration of the flatting agent in the high-resolution negative photoresist is 300 to 1500 ppm. The high-resolution negative photoresist provided by the invention is good in coating uniformity, a relatively good graphical effect is ensured while relatively high film thickness is maintained, the high-resolution negative photoresist is resistant to an electroplating process of a copper electroplating solution, a photoresist surface is not cracked, an angle is steep after electroplating, the photoresist is completely removed, and the requirement of a high-resolution electroplating process for chip packaging is met. 本发明提供了一种高分辨负性光刻胶及其制备