Probe card oxide layer removing method and cleaning and testing system

The invention relates to the technical field of chip testing, in particular to a probe card oxide layer removing method and a cleaning and testing system.The probe card oxide layer removing method comprises the steps that the tip state of a probe card is checked; when the state of the needle point reaches a preset damage degree, executing needle grinding operation, including: controlling a wafer provided with a needle grinding bonding pad to move relative to the probe card, so that friction is generated between the needle grinding bonding pad and the needle point to remove an oxide layer on the needle point; the needle point state of the probe card is checked, if the needle point state does not reach the normal state, the needle grinding operation is continued, and otherwise, the needle grinding operation is ended. According to the embodiment of the invention, the grinding needle welding plate is arranged on the wafer, the relative movement of the wafer and the probe card enables the contact friction to be ge