Composite film suitable for atomic layer deposition process and preparation method thereof
The invention provides a composite film suitable for an atomic layer deposition process and a preparation method of the composite film. The composite film sequentially comprises a base film, an organic coating and an inorganic coating layer from bottom to top, wherein an inorganic matter is deposite...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a composite film suitable for an atomic layer deposition process and a preparation method of the composite film. The composite film sequentially comprises a base film, an organic coating and an inorganic coating layer from bottom to top, wherein an inorganic matter is deposited on an organic coating by adopting an atomic layer deposition process to form an inorganic coating layer, and the organic coating is selected from one or more of a polyester coating, a polyurethane coating or an acrylate coating. The method comprises the following steps: (1) coating a raw material for preparing an organic coating on the surface of a substrate film, and curing and forming the organic coating through a drying or ultraviolet curing process; and (2) depositing an inorganic coating layer on the surface of the organic coating by adopting a plasma enhanced atomic layer deposition process to obtain the final composite film. The organic coating in the composite film provided by the invention is not easy to |
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