Bearing head and chemical mechanical polishing system

The invention discloses a bearing head and a chemical mechanical polishing system. The bearing head comprises a pivot seat, a bearing part and a bearing part, the bearing disc is movably connected below the pivot seat; the elastic film is arranged below the bearing disc and is used for loading a wafer to be polished; the retaining ring is fixed below the bearing disc and is positioned on the peripheral side of the elastic film; the balance assembly comprises a pivot and a balance frame, the pivot is connected to the vertical hole of the pivot seat in a sliding mode, the balance frame is concentrically arranged on the bearing disc, and the spherical surface of the balance frame is hinged to the lower portion of the pivot; and the center of the contact spherical surface of the pivot and the balancing frame is not lower than the bottom surface of the retaining ring. 本发明公开了一种承载头和化学机械抛光系统，所述承载头包括：枢轴座；承载盘，活动连接于枢轴座下方；弹性膜，设置于承载盘下方，用于装载待抛光晶圆；保持环，固定于承载盘下方并位于弹性膜的外周侧；平衡组件，包括枢轴和平衡架，所述枢轴滑动连接于枢轴座的竖向孔，所述平衡架同心设置于承载盘且其球面铰接于枢轴的