Inverter power supply module

The present disclosure relates to an inverter power supply module including a ceramic substrate (110), an LTCC substrate (120) disposed spaced apart from an upper portion of the ceramic substrate (110), and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on an upper...

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Bibliographische Detailangaben
Hauptverfasser:	WOO KYUNG-HWAN, PARK SEUNG-GON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRICITY GENERATION
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Beschreibung
Zusammenfassung:	The present disclosure relates to an inverter power supply module including a ceramic substrate (110), an LTCC substrate (120) disposed spaced apart from an upper portion of the ceramic substrate (110), and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on an upper surface of the ceramic substrate (110) and an upper surface bonded to an external electrode (123) of the LTCC substrate (120). An advantage of the present disclosure is that it is possible to provide an inverter power module having more improved function and operational reliability by using a ceramic substrate and an LTCC substrate. 本公开涉及一种逆变器电源模块，包括陶瓷衬底(110)，设置成与陶瓷衬底(110)的上部间隔开的LTCC衬底(120)，以及半导体芯片(130)，其具有接合到陶瓷衬底(110)的上表面上的金属图案(112)的下表面和接合到LTCC衬底(120)的外部电极(123)的上表面。本公开的优点在于能够通过使用陶瓷衬底和LTCC衬底来提供具有更加改善的功能和操作可靠性的逆变器电源模块。