Semiconductor device
In a semiconductor device (100) in which a plurality of cavity structures are formed in a matrix, a portion of a back surface conductor (5) exposed from a substrate (2) at each recess portion functions as a heat sink (5h) on which a semiconductor element (4) is mounted, the semiconductor device (100...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | In a semiconductor device (100) in which a plurality of cavity structures are formed in a matrix, a portion of a back surface conductor (5) exposed from a substrate (2) at each recess portion functions as a heat sink (5h) on which a semiconductor element (4) is mounted, the semiconductor device (100) is an integrally molded article integrally molded with a molding material (1) sealing the front surface of the substrate (2), and the back surface conductor (5) is configured so that the back surface conductor (5) and the heat sink (5h) function as a heat sink (5h) on which the semiconductor element (4) is mounted. An electrode (5e) for electrically connecting to the outside is formed, in addition to the heat sink (5h), corresponding to each of the plurality of cavity structures, and a support part (6) is formed, the support part (6) being disposed at a position separated from a cutting line (Ld) dividing each of the cavity structures into individual pieces and closer to the cutting line (Ld) than the heat sink ( |
|---|