Novel organosilicon compound, novel crosslinking agent, curable composition, prepreg, laminate, metal-clad laminate, and wiring substrate

The present invention provides a novel organosilicon compound suitable for use as a crosslinking agent or the like, a novel crosslinking agent, a curable composition, a prepreg, a laminate, a metal-clad laminate, and a wiring substrate. An organosilicon compound represented by formula (1TQ). # imgabs0 # (In the formula, M represents a single bond or an alkylene group having 1-20 carbon atoms and optionally having a substituent. The benzene ring may have a substituent. And the substitution position of the vinyl group on the benzene ring is arbitrary. And n is an integer of 3 or 4. R is a hydrogen atom, a hydroxyl group or an organic group, and when R is an organic group, an atom bonded with Si is C; ). 本发明提供适合作为交联剂等使用的新型有机硅化合物、新型交联剂、固化性组合物、预浸料、层叠体、覆金属层叠板和配线基板。一种下式(1TQ)表示的有机硅化合物。#imgabs0#(上式中，M为单键或可以具有取代基的碳原子数1～20的亚烷基。苯环可以具有取代基。苯环上的乙烯基的取代位置是任意的。n为3或4的整数。R为氢原子、羟基或有机基团，R为有机基团时，与Si键合的原子为C。)。