Manufacturing process for improving flatness of solder mask layer of carrier plate

The invention discloses a manufacturing process for improving the flatness of a solder mask layer of a carrier plate, and the process of the manufacturing process comprises the steps of coating, baking and film pressing, specifically, the coating process comprises the steps of coating solder mask liquid ink on a carrier film, and the carrier film is a release film; the baking process comprises the step of baking for 60 minutes at 70 DEG C; according to the manufacturing process for improving the flatness of the support plate solder mask layer, additional equipment does not need to be input, monopoly of imported dry ink can be broken through, the requirement for the flatness of the high-standard support plate solder mask layer can be met without additionally increasing transportation and storage cost and production environment modification cost, and the manufacturing process has extremely high commercial value. 本发明公开了一种改善载板阻焊层平整度的制作工艺，制作工艺的流程为：涂布→烘烤→压膜，其中：涂布工序具体为：将阻焊液态油墨涂覆在载膜上，载膜为离型膜；烘烤工序为：在70摄氏度下烘烤60min；本发明所设