Manufacturing method of PCB (Printed Circuit Board) with groove milled at side edge
The invention provides a manufacturing method of a PCB (printed circuit board) with grooves formed in the side edges, and belongs to the technical field of circuit board manufacturing. The method comprises the following steps: firstly, cutting a large-size substrate into a core board conforming to t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a manufacturing method of a PCB (printed circuit board) with grooves formed in the side edges, and belongs to the technical field of circuit board manufacturing. The method comprises the following steps: firstly, cutting a large-size substrate into a core board conforming to the PNL size of a PCB (Printed Circuit Board), manufacturing an inner-layer circuit pattern on the core board, and then sequentially carrying out scanning and VRS maintenance; after maintenance, laminating the core board and the prepreg PP to obtain a semi-finished PCB; sequentially carrying out drilling, groove milling, side groove milling, copper deposition and electroplating on the PCB semi-finished product board; after electroplating is completed, sequentially manufacturing an outer layer circuit pattern, performing pattern electroplating and performing alkaline etching; and after alkaline etching, scanning, VRS maintenance, resistance welding, character printing, flying probe testing, forming and visual inspect |
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