Three-dimensional phased-array antenna package and preparation method thereof

The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first...

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Hauptverfasser: JIANG MANKAI, CHEN JINXING, CAO YUNFEI, HUANG LICHANG, XU XIAOBIN, XU ZIXIONG
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creator JIANG MANKAI
CHEN JINXING
CAO YUNFEI
HUANG LICHANG
XU XIAOBIN
XU ZIXIONG
description The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first radio frequency module on the first antenna shell, and correspondingly and electrically connecting the first radio frequency module with the first vertical interconnection hole to obtain a first antenna packaging body; providing a second antenna housing; performing second vertical hole forming processing on the second antenna shell to form a second vertical interconnection hole corresponding to the first vertical interconnection hole; forming a second radio frequency module on one side of the second antenna shell, wherein the second radio frequency module is correspondingly and electrically connected with the first vertical interconnection hole; forming an antenna module on the other side of the second antenna she
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117394015A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117394015A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117394015A3</originalsourceid><addsrcrecordid>eNqNjLEKAjEQBdNYiPoP6wcEDKeIpRyKjVbXH4t5Zw7vNmGTxr83hR9gNQwMszT3Lihg_ThD8hiFJ0qBM7xlVf4QS4EIU-Lnm1-o7ikpEiuXmtOMEqKnEqCIw9osBp4yNj-uzPZ66dqbRYo9cp1AUPr24dyxOe137nBu_mm-A9I2gg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Three-dimensional phased-array antenna package and preparation method thereof</title><source>esp@cenet</source><creator>JIANG MANKAI ; CHEN JINXING ; CAO YUNFEI ; HUANG LICHANG ; XU XIAOBIN ; XU ZIXIONG</creator><creatorcontrib>JIANG MANKAI ; CHEN JINXING ; CAO YUNFEI ; HUANG LICHANG ; XU XIAOBIN ; XU ZIXIONG</creatorcontrib><description>The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first radio frequency module on the first antenna shell, and correspondingly and electrically connecting the first radio frequency module with the first vertical interconnection hole to obtain a first antenna packaging body; providing a second antenna housing; performing second vertical hole forming processing on the second antenna shell to form a second vertical interconnection hole corresponding to the first vertical interconnection hole; forming a second radio frequency module on one side of the second antenna shell, wherein the second radio frequency module is correspondingly and electrically connected with the first vertical interconnection hole; forming an antenna module on the other side of the second antenna she</description><language>chi ; eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; LINE CONNECTORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240112&amp;DB=EPODOC&amp;CC=CN&amp;NR=117394015A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240112&amp;DB=EPODOC&amp;CC=CN&amp;NR=117394015A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG MANKAI</creatorcontrib><creatorcontrib>CHEN JINXING</creatorcontrib><creatorcontrib>CAO YUNFEI</creatorcontrib><creatorcontrib>HUANG LICHANG</creatorcontrib><creatorcontrib>XU XIAOBIN</creatorcontrib><creatorcontrib>XU ZIXIONG</creatorcontrib><title>Three-dimensional phased-array antenna package and preparation method thereof</title><description>The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first radio frequency module on the first antenna shell, and correspondingly and electrically connecting the first radio frequency module with the first vertical interconnection hole to obtain a first antenna packaging body; providing a second antenna housing; performing second vertical hole forming processing on the second antenna shell to form a second vertical interconnection hole corresponding to the first vertical interconnection hole; forming a second radio frequency module on one side of the second antenna shell, wherein the second radio frequency module is correspondingly and electrically connected with the first vertical interconnection hole; forming an antenna module on the other side of the second antenna she</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LINE CONNECTORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKAjEQBdNYiPoP6wcEDKeIpRyKjVbXH4t5Zw7vNmGTxr83hR9gNQwMszT3Lihg_ThD8hiFJ0qBM7xlVf4QS4EIU-Lnm1-o7ikpEiuXmtOMEqKnEqCIw9osBp4yNj-uzPZ66dqbRYo9cp1AUPr24dyxOe137nBu_mm-A9I2gg</recordid><startdate>20240112</startdate><enddate>20240112</enddate><creator>JIANG MANKAI</creator><creator>CHEN JINXING</creator><creator>CAO YUNFEI</creator><creator>HUANG LICHANG</creator><creator>XU XIAOBIN</creator><creator>XU ZIXIONG</creator><scope>EVB</scope></search><sort><creationdate>20240112</creationdate><title>Three-dimensional phased-array antenna package and preparation method thereof</title><author>JIANG MANKAI ; CHEN JINXING ; CAO YUNFEI ; HUANG LICHANG ; XU XIAOBIN ; XU ZIXIONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117394015A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LINE CONNECTORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG MANKAI</creatorcontrib><creatorcontrib>CHEN JINXING</creatorcontrib><creatorcontrib>CAO YUNFEI</creatorcontrib><creatorcontrib>HUANG LICHANG</creatorcontrib><creatorcontrib>XU XIAOBIN</creatorcontrib><creatorcontrib>XU ZIXIONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG MANKAI</au><au>CHEN JINXING</au><au>CAO YUNFEI</au><au>HUANG LICHANG</au><au>XU XIAOBIN</au><au>XU ZIXIONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Three-dimensional phased-array antenna package and preparation method thereof</title><date>2024-01-12</date><risdate>2024</risdate><abstract>The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first radio frequency module on the first antenna shell, and correspondingly and electrically connecting the first radio frequency module with the first vertical interconnection hole to obtain a first antenna packaging body; providing a second antenna housing; performing second vertical hole forming processing on the second antenna shell to form a second vertical interconnection hole corresponding to the first vertical interconnection hole; forming a second radio frequency module on one side of the second antenna shell, wherein the second radio frequency module is correspondingly and electrically connected with the first vertical interconnection hole; forming an antenna module on the other side of the second antenna she</abstract><oa>free_for_read</oa></addata></record>
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subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
LINE CONNECTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
title Three-dimensional phased-array antenna package and preparation method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T00%3A25%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIANG%20MANKAI&rft.date=2024-01-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117394015A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true