Three-dimensional phased-array antenna package and preparation method thereof

The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first...

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Bibliographische Detailangaben
Hauptverfasser:	JIANG MANKAI, CHEN JINXING, CAO YUNFEI, HUANG LICHANG, XU XIAOBIN, XU ZIXIONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention provides a three-dimensional phased-array antenna package and a preparation method thereof. The method includes providing a first antenna housing; performing first vertical hole forming processing on the first antenna shell to form a first vertical interconnection hole; forming a first radio frequency module on the first antenna shell, and correspondingly and electrically connecting the first radio frequency module with the first vertical interconnection hole to obtain a first antenna packaging body; providing a second antenna housing; performing second vertical hole forming processing on the second antenna shell to form a second vertical interconnection hole corresponding to the first vertical interconnection hole; forming a second radio frequency module on one side of the second antenna shell, wherein the second radio frequency module is correspondingly and electrically connected with the first vertical interconnection hole; forming an antenna module on the other side of the second antenna she