Solderless and pressure contact connections
A solderless and pressure contact connection is disclosed. The pressure contact assembly comprises a power supply substrate, a chip and a lead. The power supply substrate has a surface connected to the ceramic wafer and the cavity. The chip is soldered to the surface. The lead is to be inserted into...
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| Hauptverfasser: | , , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A solderless and pressure contact connection is disclosed. The pressure contact assembly comprises a power supply substrate, a chip and a lead. The power supply substrate has a surface connected to the ceramic wafer and the cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion for connection to an external device and a bottom portion for fitting in the cavity.
公开了一种无焊料和压力接触连接。其中压力接触组件包括电源基板、芯片和引线。电源基板具有连接到陶瓷片和空腔的表面。芯片被焊接在表面。引线将被插入到空腔中，并且具有用于连接到外部设备的顶部部分和用于适配在空腔中的底部部分。 |
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