Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor
The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium comp...
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| creator | HUANG YAWEI ZONG YUE WANG ZHENG CHEN JINFANG XING SHUAI WU XIAOWEI XIA RUNZHI WU JIANI |
| description | The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium compound to polish the surface of the superconducting niobium cavity, and changing the proportion of the BCP acid solution to increase the gas solubility of NO gas in the BCP acid solution and reduce the viscosity of the BCP acid solution, so that the surface of the superconducting niobium cavity is polished. Therefore, pits are prevented from being generated on the surface of the superconducting niobium cavity in the BCP polishing process. The invention further relates to BCP acid liquor, k = V (HF + HNO3)/V (H3PO4) > = 2, and n = V (HNO3)/V (HF) > 1.64. According to the method for solving the problem that pits are generated on the buffer chemical polishing surface of the superconducting niobium cavity and the BCP aci |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117385361A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117385361A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117385361A3</originalsourceid><addsrcrecordid>eNqNjDsOwjAQRNNQIOAOywEooohPCxGIBkRBHxl7Ha_keI0_kTgDlyZBHIBqnjQzb1q8L5gMK9AcILLtybVgRFAQPacIwinwNECLDoNIqIAdPLLWGEAa7EgKC54tRTNeYw5aSATWA3oMkp3KMo2VI35Q7kCKntLraz7UNxCSFFh6Zg7zYqKFjbj45axYno73-rxCzw1GP4gdpqa-luW22q2rTbmv_tl8AM7BTUk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor</title><source>esp@cenet</source><creator>HUANG YAWEI ; ZONG YUE ; WANG ZHENG ; CHEN JINFANG ; XING SHUAI ; WU XIAOWEI ; XIA RUNZHI ; WU JIANI</creator><creatorcontrib>HUANG YAWEI ; ZONG YUE ; WANG ZHENG ; CHEN JINFANG ; XING SHUAI ; WU XIAOWEI ; XIA RUNZHI ; WU JIANI</creatorcontrib><description>The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium compound to polish the surface of the superconducting niobium cavity, and changing the proportion of the BCP acid solution to increase the gas solubility of NO gas in the BCP acid solution and reduce the viscosity of the BCP acid solution, so that the surface of the superconducting niobium cavity is polished. Therefore, pits are prevented from being generated on the surface of the superconducting niobium cavity in the BCP polishing process. The invention further relates to BCP acid liquor, k = V (HF + HNO3)/V (H3PO4) > = 2, and n = V (HNO3)/V (HF) > 1.64. According to the method for solving the problem that pits are generated on the buffer chemical polishing surface of the superconducting niobium cavity and the BCP aci</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240112&DB=EPODOC&CC=CN&NR=117385361A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240112&DB=EPODOC&CC=CN&NR=117385361A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG YAWEI</creatorcontrib><creatorcontrib>ZONG YUE</creatorcontrib><creatorcontrib>WANG ZHENG</creatorcontrib><creatorcontrib>CHEN JINFANG</creatorcontrib><creatorcontrib>XING SHUAI</creatorcontrib><creatorcontrib>WU XIAOWEI</creatorcontrib><creatorcontrib>XIA RUNZHI</creatorcontrib><creatorcontrib>WU JIANI</creatorcontrib><title>Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor</title><description>The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium compound to polish the surface of the superconducting niobium cavity, and changing the proportion of the BCP acid solution to increase the gas solubility of NO gas in the BCP acid solution and reduce the viscosity of the BCP acid solution, so that the surface of the superconducting niobium cavity is polished. Therefore, pits are prevented from being generated on the surface of the superconducting niobium cavity in the BCP polishing process. The invention further relates to BCP acid liquor, k = V (HF + HNO3)/V (H3PO4) > = 2, and n = V (HNO3)/V (HF) > 1.64. According to the method for solving the problem that pits are generated on the buffer chemical polishing surface of the superconducting niobium cavity and the BCP aci</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDsOwjAQRNNQIOAOywEooohPCxGIBkRBHxl7Ha_keI0_kTgDlyZBHIBqnjQzb1q8L5gMK9AcILLtybVgRFAQPacIwinwNECLDoNIqIAdPLLWGEAa7EgKC54tRTNeYw5aSATWA3oMkp3KMo2VI35Q7kCKntLraz7UNxCSFFh6Zg7zYqKFjbj45axYno73-rxCzw1GP4gdpqa-luW22q2rTbmv_tl8AM7BTUk</recordid><startdate>20240112</startdate><enddate>20240112</enddate><creator>HUANG YAWEI</creator><creator>ZONG YUE</creator><creator>WANG ZHENG</creator><creator>CHEN JINFANG</creator><creator>XING SHUAI</creator><creator>WU XIAOWEI</creator><creator>XIA RUNZHI</creator><creator>WU JIANI</creator><scope>EVB</scope></search><sort><creationdate>20240112</creationdate><title>Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor</title><author>HUANG YAWEI ; ZONG YUE ; WANG ZHENG ; CHEN JINFANG ; XING SHUAI ; WU XIAOWEI ; XIA RUNZHI ; WU JIANI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117385361A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG YAWEI</creatorcontrib><creatorcontrib>ZONG YUE</creatorcontrib><creatorcontrib>WANG ZHENG</creatorcontrib><creatorcontrib>CHEN JINFANG</creatorcontrib><creatorcontrib>XING SHUAI</creatorcontrib><creatorcontrib>WU XIAOWEI</creatorcontrib><creatorcontrib>XIA RUNZHI</creatorcontrib><creatorcontrib>WU JIANI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG YAWEI</au><au>ZONG YUE</au><au>WANG ZHENG</au><au>CHEN JINFANG</au><au>XING SHUAI</au><au>WU XIAOWEI</au><au>XIA RUNZHI</au><au>WU JIANI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor</title><date>2024-01-12</date><risdate>2024</risdate><abstract>The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium compound to polish the surface of the superconducting niobium cavity, and changing the proportion of the BCP acid solution to increase the gas solubility of NO gas in the BCP acid solution and reduce the viscosity of the BCP acid solution, so that the surface of the superconducting niobium cavity is polished. Therefore, pits are prevented from being generated on the surface of the superconducting niobium cavity in the BCP polishing process. The invention further relates to BCP acid liquor, k = V (HF + HNO3)/V (H3PO4) > = 2, and n = V (HNO3)/V (HF) > 1.64. According to the method for solving the problem that pits are generated on the buffer chemical polishing surface of the superconducting niobium cavity and the BCP aci</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE |
| title | Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor |
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