Method for solving hard spots and pits generated on buffer chemical polishing surface of superconducting niobium cavity and BCP acid liquor
The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium comp...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for solving pocking marks and pits generated on a buffer chemical polishing surface of a superconducting niobium cavity, which comprises the following steps: reacting a BCP acid solution formed by mixing HF, HNO3 and H3PO4 with niobium to form a soluble niobium compound to polish the surface of the superconducting niobium cavity, and changing the proportion of the BCP acid solution to increase the gas solubility of NO gas in the BCP acid solution and reduce the viscosity of the BCP acid solution, so that the surface of the superconducting niobium cavity is polished. Therefore, pits are prevented from being generated on the surface of the superconducting niobium cavity in the BCP polishing process. The invention further relates to BCP acid liquor, k = V (HF + HNO3)/V (H3PO4) > = 2, and n = V (HNO3)/V (HF) > 1.64. According to the method for solving the problem that pits are generated on the buffer chemical polishing surface of the superconducting niobium cavity and the BCP aci |
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