Electronic component

The invention provides an electronic component. An electronic component (101) is provided with: a semiconductor substrate (1); an insulator layer (2) formed on the semiconductor substrate (1); a lower electrode (31) formed so as to face the semiconductor substrate (1) with the insulator layer (2) therebetween; an upper electrode (32); and a dielectric layer (4) formed so as to face the semiconductor substrate (1) with the insulator layer (2) interposed therebetween. The lower electrode (31), the upper electrode (32), and the dielectric layer (4) constitute a passive element. A conduction path (5) that passes through the insulator layer (2) and connects the lower electrode (31) and the semiconductor substrate (1) is formed in the insulator layer (2). 本发明提供一种电子部件。电子部件(101)具备：半导体基板(1)；绝缘体层(2)，其形成在该半导体基板(1)上；下部电极(31)，其隔着绝缘体层(2)而与半导体基板(1)相向地形成；上部电极(32)；以及电介质层(4)，其隔着绝缘体层(2)而与半导体基板(1)相向地形成。通过下部电极(31)、上部电极(32)和电介质层(4)构成无源元件。在绝缘体层(2)形成有贯通该绝缘体层(2)并使下部电极(31)与半导体基板(1)导通的导通路径(5)。