Component embedding method and PCB structure with embedded component

The invention provides a method for embedding a component and a PCB structure with the embedded component, and the method comprises the following steps: stacking at least two core boards, and arranging a first prepreg between every two adjacent core boards in a stacking manner to obtain a stacked body which is provided with at least one through groove penetrating in the thickness direction; a second prepreg and a first copper foil are sequentially arranged at one end of the through groove; putting the component into the through groove, and sequentially arranging a third prepreg and a second copper foil at the other end of the through groove to obtain a pre-pressed piece; performing hot pressing on the pre-pressed part to obtain a pressed part; and performing windowing processing on the press-fit piece to expose an electrode of the component, and electroplating a metal lead at the exposed electrode to obtain the PCB structure embedded with the component. According to the component embedding method, the stable