Copper deposition process for manufacturing PCB (Printed Circuit Board) by using graphene material

The invention discloses a copper deposition process for preparing a PCB (printed circuit board) by using a graphene material, and relates to the technical field of copper deposition processes, the process comprises the following steps: firstly, drilling a hole in the PCB, cleaning and drying the PCB...

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Bibliographische Detailangaben
Hauptverfasser: KIM SAE-YONG, SHU SHIQUAN, LIU LONGTAN, WANG TIANWEN, LI MIN, RAO ZHIQIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a copper deposition process for preparing a PCB (printed circuit board) by using a graphene material, and relates to the technical field of copper deposition processes, the process comprises the following steps: firstly, drilling a hole in the PCB, cleaning and drying the PCB in a cleaning box, soaking the PCB in a groove filled with a graphene solution for 40-60 seconds after drying, taking out the PCB, and washing and drying the PCB; carrying out micro-etching on the washed and dried PCB, cleaning, and then carrying out electro-coppering; wherein a preparation method of the graphene solution comprises the following steps: dissolving graphene powder and calcium carbonate powder in water, and uniformly mixing; according to the method, irregular tiny holes can be formed in the inner wall of the graphene layer, a part of the tiny holes exist independently, a part of the tiny holes communicate with one another, during copper electroplating, copper molecules enter the tiny holes and are co