Substrate element, circuit board and chip connection method

The invention provides a substrate element, a circuit board and a chip connection method, and the substrate element comprises a substrate, at least one side of the substrate is provided with a first bump used for connecting the element, and the surface, used for connecting the element, of the first...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIAO HAOYANG, SONG GUANQIANG, ZHANG WEIJIE, YU GONGCHI, XIONG YANCHUN, LI YUHONG, JIANG JING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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