Substrate element, circuit board and chip connection method

The invention provides a substrate element, a circuit board and a chip connection method, and the substrate element comprises a substrate, at least one side of the substrate is provided with a first bump used for connecting the element, and the surface, used for connecting the element, of the first bump is a plane. According to the mode, the surface of the first salient point connecting element on the substrate element is arranged to be the plane, so that the first salient point is of a plane structure. Therefore, when the substrate element is connected with other elements, the phenomena of slippage, deviation and the like are avoided, the alignment and fitting precision of the substrate element and other elements can be improved, and the conditions of deviation and short circuit abnormity when the substrate element and other elements are mounted are prevented. 本申请提供了一种基板元件和电路板及芯片连接方法，其中，基板元件包括：基板，基板的至少一侧设置有用于连接元件的第一凸点，第一凸点用于连接元件的表面为平面。通过上述方式，通过将基板元件上的第一凸点连接元件的表面设置为平面，使得第一凸点为平面结构。使得将基板元件连接其他元件时不会出现滑移、偏移等现象，可提