Integrated circuit DPA optimization method suitable for aviation airborne equipment

The invention provides an integrated circuit DPA optimization method suitable for aviation airborne equipment. Comprising the following steps of: classifying plastic package integrated circuits according to'highest working temperature ', stipulating that components of production batches in front and back 10 weeks are not repeatedly subjected to DPA, combining different'production batches' in one year and within one year into a'inspection batch ', and setting different DPA items according to different quality assurance grades. The integrated circuit DPA optimization method suitable for the aviation airborne equipment has the beneficial effects that production batches in one year are subjected to batch combination, the similar production batches (within 10 weeks before and after) are inquired to avoid repeated DPA, and a component manufacturer collects DPA reports of the integrated circuit; and the types and the number of integrated circuits for DPA are greatly reduced. 本发明提供了一种适用于航空机载设备的集成电路DPA优化方法，包括：按照"最高工作温