Tin soldering and glue sealing equipment for relay processing

The invention relates to the technical field of relay processing, in particular to soldering tin glue sealing equipment for relay processing, which comprises a bottom frame and a base fixedly connected to the front end of the bottom frame, a mounting plate is movably arranged on the upper side of th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	QING XINHUA, YU PENGXIN, WANG JUN, LIN LUOHAO, FANG XU, PENG BIHUI, CHEN HAIDUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to the technical field of relay processing, in particular to soldering tin glue sealing equipment for relay processing, which comprises a bottom frame and a base fixedly connected to the front end of the bottom frame, a mounting plate is movably arranged on the upper side of the bottom frame, a portal frame is further movably arranged on the upper side of the bottom frame, and a plurality of glue injection guns are fixedly connected to the portal frame; the tin soldering and glue sealing equipment for relay processing further comprises a shaking mechanism which is arranged at the bottom of the mounting plate and used for shaking the relay filled with glue on the mounting plate; the drying mechanism is arranged on the portal frame and the base and used for rapidly drying liquid glue on the relay, the shaking-up mechanism can guarantee soldering tin glue sealing completeness and smoothness of the glue sealing surface, the glue sealing quality of the relay is effectively improved, the dryin