MULTILAYER ASSEMBLY HAVING SURFACE RECESSES AND

Certain configurations of a multi-layer assembly are described. In some embodiments, the multilayer component may include a core layer, a skin layer, and one or more recesses in a surface of the multilayer component. In other configurations, the multilayer component may include a core layer, a skin...

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1. Verfasser:	EVERS PETER THOMAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Zusammenfassung:	Certain configurations of a multi-layer assembly are described. In some embodiments, the multilayer component may include a core layer, a skin layer, and one or more recesses in a surface of the multilayer component. In other configurations, the multilayer component may include a core layer, a skin layer, one or more recesses in a surface of the multilayer component, and one or more additional layers. 描述了多层组件的某些配置。在某些实施例中，多层组件可以包括芯层、表层和多层组件的表面中的一个或多个凹陷。在其他配置中，多层组件可以包括芯层、表层、多层组件的表面中的一个或多个凹陷以及一个或更多个附加层。