Non-airtight packaging method for Ka-band stepped radio frequency cavity

The invention discloses a non-airtight packaging method for a Ka-band stepped radio frequency cavity. The method comprises the following steps: S1, preprocessing a microwave substrate; s2, mounting a chip in the sinking step cavity of the microwave substrate; s3, interconnecting radio frequency and low frequency input and output pads of the chip with the bonding pad in the sinking step cavity by using a bonding wire; s4, cleaning the combination of the chip obtained in the step S3 and the microwave substrate; s5, coating the upper part of the chip with epoxy insulation glue, preheating the combination of the chip coated with the epoxy insulation glue and the microwave substrate, and enabling the epoxy insulation glue in a preheated state to wrap the chip and the bonding lead in the sinking step cavity; s6, curing the epoxy insulation paste; and S7, bonding a wave-absorbing material on the cured epoxy insulation paste. According to the invention, the assembly, protection and electromagnetic shielding of the ra