Radio frequency transition structure based on wafer level fan-out packaging

The invention relates to the technical field of radio frequency electrical interconnection, and particularly discloses a radio frequency transition structure based on wafer-level fan-out packaging. Comprising a radio frequency chip, a rewiring routing structure located above the radio frequency chip and connected with the radio frequency chip, a rewiring metal ground routing wire arranged on the same layer as the rewiring routing structure and located on the outer side of the rewiring routing structure, and a signal transmission metal solder ball arranged on the rewiring routing structure. The grounding metal solder ball is arranged on the rewiring metal ground wire; and the re-wiring metal ground wire is connected with the radio frequency chip. According to the invention, electrical interconnection transition of the chip radio frequency interface is realized based on the wafer-level fan-out packaging rewiring structure and the ball grid array, signals can be well shielded, and integrated application of the p