Temperature compensation device and semiconductor substrate heating assistance system

The invention provides a temperature compensation device, which is applied to a semiconductor substrate heating unit and comprises an auxiliary temperature adjusting part, an elastic component and a fixing part, the auxiliary temperature adjusting part comprises a conductive part, the conductive par...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUN YUANBIN, HAN YU, JIANG YUNHE, CHEN XINGLONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides a temperature compensation device, which is applied to a semiconductor substrate heating unit and comprises an auxiliary temperature adjusting part, an elastic component and a fixing part, the auxiliary temperature adjusting part comprises a conductive part, the conductive part is used for being connected with a circuit board, the auxiliary temperature adjusting part is arranged at the bottom of the semiconductor substrate heating unit to conduct temperature compensation adjustment on the semiconductor substrate heating unit, and the elastic assembly is arranged between the fixing part and the auxiliary temperature adjusting part and used for adjusting the temperature of the semiconductor substrate heating unit. The elastic assembly is used for adjusting the distance between the auxiliary temperature adjusting piece and the semiconductor substrate heating unit. Therefore, the temperature compensation device can be installed at the bottom of the semiconductor substrate heating unit subse