Selective laser melting forming method for regulating and controlling size of air film hole

The invention relates to the technical field of selective laser melting forming, in particular to a selective laser melting forming method for regulating and controlling the size of a film hole, which comprises the following steps of: (a) regulating contour process parameters of a printing film hole...

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Bibliographische Detailangaben
Hauptverfasser: ZHANG XIWEN, QIN XIAN, DONG QINGZHU, HUO JUNMEI, PENG SHIQING, HUANG LIUJIE, CHU RUIKUN, LIU GEN, ZOU RONGKUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of selective laser melting forming, in particular to a selective laser melting forming method for regulating and controlling the size of a film hole, which comprises the following steps of: (a) regulating contour process parameters of a printing film hole characteristic structural member, and analyzing and determining target contour process parameters; (b) adjusting the lower surface process parameters of the printing film hole feature structural member, and analyzing and determining the target lower surface process parameters; (c) adjusting a light spot size parameter, and analyzing and determining a target light spot size parameter; and (d) under the condition that the parameters are not changed, the placing angle of the part is adjusted, and the placing angle of the target part is analyzed and determined. According to the method, the outline process parameters, the lower surface process parameters, the light spot size and the placement angle are combined and opt