High-entropy copper core ball and preparation method thereof
The invention provides a high-entropy copper core ball and a preparation method thereof. The preparation method of the high-entropy copper-core ball comprises the following steps: S10, electroplating nickel metal on the outer surface of the copper-core ball to obtain a first intermediate; s20, the h...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a high-entropy copper core ball and a preparation method thereof. The preparation method of the high-entropy copper-core ball comprises the following steps: S10, electroplating nickel metal on the outer surface of the copper-core ball to obtain a first intermediate; s20, the high-entropy alloy and the first intermediate are subjected to vacuum hot dipping barrel plating treatment, induction uniform heating is conducted, the heating temperature is lower than the melting point of the first intermediate, and a second intermediate is obtained; s30, screening the second intermediate through a screen to obtain plated high-entropy copper core balls, and cooling the plated high-entropy copper core balls to obtain a third intermediate; s40, carrying out fine grinding treatment on the third intermediate to obtain a fourth intermediate; s50, screening the fourth intermediate to obtain a high-entropy copper core ball; wherein the high-entropy copper core ball is at least coated with the high-entrop |
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