High-performance pre-cured conductive adhesive film and preparation method thereof

The invention discloses a high-performance pre-cured conductive adhesive film and a preparation method thereof. The high-performance pre-cured conductive adhesive film comprises a pre-cured conductive adhesive film layer and a release film protection layer, the conductive adhesive film layer compris...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YI RONGJUN, SONG YANRU, LI XIAOJUAN, WANG HONG, KE JIEXI, WANG FENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a high-performance pre-cured conductive adhesive film and a preparation method thereof. The high-performance pre-cured conductive adhesive film comprises a pre-cured conductive adhesive film layer and a release film protection layer, the conductive adhesive film layer comprises the following components in parts by weight: 100 parts of epoxy resin; 400-800 parts of a conductive filler; 2-5 parts of a reactive diluent; 5-20 parts of a toughening agent; 5-20 parts of a latent curing agent; 2-5 parts of an additive curing agent; 0.2-2 parts of an accelerant; 1-2 parts of a coupling agent; 10-20 parts of a solvent; the release film protection layer comprises a substrate layer located below the conductive adhesive film layer and a back film layer covering the conductive adhesive film layer. In the preparation process of the conductive adhesive film, the pre-curing degree and the film-forming property are effectively controlled by using the addition type curing agent, and the use of large-bre