Device of gas-assisted polishing system and using method of device

The invention belongs to the technical field of gas-assisted polishing, and provides a gas-assisted polishing system device and a using method thereof.The gas-assisted polishing system device comprises a supporting frame, a supporting plate is fixedly connected to the top end of the supporting frame...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XU YONGCHAO, YANG JIYUAN, YANG DAIRUI, LIU QIONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the technical field of gas-assisted polishing, and provides a gas-assisted polishing system device and a using method thereof.The gas-assisted polishing system device comprises a supporting frame, a supporting plate is fixedly connected to the top end of the supporting frame, an instrument panel and a pressurizing mechanism are installed on the outer side wall of the supporting plate, and the pressurizing mechanism is arranged at the top end of the supporting frame; the pressurizing mechanism further comprises a water injection mechanism and a ventilation mechanism; the gas supersaturated solution is prepared through the hydrophobic membrane contact system, the whole CMP system is contained in the sealed pressure tank, deviation between the gas dissolved amount in the gas supersaturated solution and the solution in the atmospheric environment when the solution makes contact with air can be avoided, the pressure intensity in the polishing tank can be changed in the polishing process, a