Single packaging body fusing multiple chip packaging

The invention, which relates to the integrated circuit field, discloses a single packaging body integrating multiple chip packaging, comprising a packaging module, a heat dissipation optimization module, an electromagnetic interference isolation module, a simulation verification module, a maintenance upgrading module, a fault maintenance module, a power management module, a debugging optimization module, an electrostatic impedance protection module and a control interface module. Through the heat dissipation optimization module, the heat dissipation effect of the whole packaging body is improved, and the heat dissipation problem of a traditional packaging body is solved; signal interference among different modules is isolated through the electromagnetic interference isolation module; system-level design and verification are carried out through the simulation verification module; different chip modules are independently designed through a modular design method; the maintenance and upgrading module is provided