Wafer regular addressing and receiving device

The invention relates to a wafer regular addressing and receiving device which comprises a wafer addressing and receiving assembly, and the wafer addressing and receiving assembly comprises a wafer addressing supporting frame, a wafer addressing moving plate, a wafer addressing servo motor, a material box supporting plate, a material box, a wafer addressing belt transmission mechanism and a wafer addressing lead screw transmission mechanism. A wafer tidying assembly is arranged on one side of the wafer addressing and receiving assembly along the negative direction of the Y axis; the wafer normalizing assembly comprises a jacking electric cylinder, a normalizing rear supporting assembly, a normalizing execution assembly, a normalizing left connecting rod assembly and a normalizing right connecting rod assembly. According to the invention, the wafers with the steel rings are neatened through the wafer neatening assembly, so that the wafers with the steel rings are right opposite to the wafer material box, and t