Method for detecting die bonding state by using airflow

The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LU YANHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS POSTAL SORTING SEMICONDUCTOR DEVICES SEPARATING SOLIDS FROM SOLIDS SORTING SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING TRANSPORTING
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