Method for detecting die bonding state by using airflow

The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block of the crystal grain to other blocks of the crystal grain and has a diffusion trend, so that the crystal grain is gradually separated from the die bonding device and is fixed on the substrate; the airflow flows along the surfaces of the crystal grains; sensing the flow or pressure change degree of the airflow at different positions and obtaining a plurality of pieces of sensing information; according to the multiple pieces of sensing information, the distance change degree of separation between the crystal grains and the crystal fixing device is judged; the diffusion trend of the bonding wave is judged according to the change degree of the separation distance between the crystal grains and the crystal fixing device