Method for detecting die bonding state by using airflow
The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LU YANHAO |
| description | The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block of the crystal grain to other blocks of the crystal grain and has a diffusion trend, so that the crystal grain is gradually separated from the die bonding device and is fixed on the substrate; the airflow flows along the surfaces of the crystal grains; sensing the flow or pressure change degree of the airflow at different positions and obtaining a plurality of pieces of sensing information; according to the multiple pieces of sensing information, the distance change degree of separation between the crystal grains and the crystal fixing device is judged; the diffusion trend of the bonding wave is judged according to the change degree of the separation distance between the crystal grains and the crystal fixing device |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117316789A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117316789A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117316789A3</originalsourceid><addsrcrecordid>eNrjZDD3TS3JyE9RSMsvUkhJLUlNLsnMS1dIyUxVSMrPSwGxi0sSS4C8SoXSYhA3MbMoLSe_nIeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxDv7GRqaGxuamVtYOhoTowYAsgAtvA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for detecting die bonding state by using airflow</title><source>esp@cenet</source><creator>LU YANHAO</creator><creatorcontrib>LU YANHAO</creatorcontrib><description>The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block of the crystal grain to other blocks of the crystal grain and has a diffusion trend, so that the crystal grain is gradually separated from the die bonding device and is fixed on the substrate; the airflow flows along the surfaces of the crystal grains; sensing the flow or pressure change degree of the airflow at different positions and obtaining a plurality of pieces of sensing information; according to the multiple pieces of sensing information, the distance change degree of separation between the crystal grains and the crystal fixing device is judged; the diffusion trend of the bonding wave is judged according to the change degree of the separation distance between the crystal grains and the crystal fixing device</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; POSTAL SORTING ; SEMICONDUCTOR DEVICES ; SEPARATING SOLIDS FROM SOLIDS ; SORTING ; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231229&DB=EPODOC&CC=CN&NR=117316789A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231229&DB=EPODOC&CC=CN&NR=117316789A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU YANHAO</creatorcontrib><title>Method for detecting die bonding state by using airflow</title><description>The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block of the crystal grain to other blocks of the crystal grain and has a diffusion trend, so that the crystal grain is gradually separated from the die bonding device and is fixed on the substrate; the airflow flows along the surfaces of the crystal grains; sensing the flow or pressure change degree of the airflow at different positions and obtaining a plurality of pieces of sensing information; according to the multiple pieces of sensing information, the distance change degree of separation between the crystal grains and the crystal fixing device is judged; the diffusion trend of the bonding wave is judged according to the change degree of the separation distance between the crystal grains and the crystal fixing device</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>POSTAL SORTING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SEPARATING SOLIDS FROM SOLIDS</subject><subject>SORTING</subject><subject>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD3TS3JyE9RSMsvUkhJLUlNLsnMS1dIyUxVSMrPSwGxi0sSS4C8SoXSYhA3MbMoLSe_nIeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxDv7GRqaGxuamVtYOhoTowYAsgAtvA</recordid><startdate>20231229</startdate><enddate>20231229</enddate><creator>LU YANHAO</creator><scope>EVB</scope></search><sort><creationdate>20231229</creationdate><title>Method for detecting die bonding state by using airflow</title><author>LU YANHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117316789A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>POSTAL SORTING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SEPARATING SOLIDS FROM SOLIDS</topic><topic>SORTING</topic><topic>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LU YANHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU YANHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for detecting die bonding state by using airflow</title><date>2023-12-29</date><risdate>2023</risdate><abstract>The invention provides a method for detecting a die bonding state by utilizing air flow. The method comprises the following steps of: separating a local block of a crystal grain from a die bonding device and contacting a substrate to form a bonding wave; the bonding wave diffuses from a local block of the crystal grain to other blocks of the crystal grain and has a diffusion trend, so that the crystal grain is gradually separated from the die bonding device and is fixed on the substrate; the airflow flows along the surfaces of the crystal grains; sensing the flow or pressure change degree of the airflow at different positions and obtaining a plurality of pieces of sensing information; according to the multiple pieces of sensing information, the distance change degree of separation between the crystal grains and the crystal fixing device is judged; the diffusion trend of the bonding wave is judged according to the change degree of the separation distance between the crystal grains and the crystal fixing device</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117316789A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS POSTAL SORTING SEMICONDUCTOR DEVICES SEPARATING SOLIDS FROM SOLIDS SORTING SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING TRANSPORTING |
| title | Method for detecting die bonding state by using airflow |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T17%3A38%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LU%20YANHAO&rft.date=2023-12-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117316789A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |